发明名称 GLOVE MOLDING METHOD AND GLOVE MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a glove molding method for no smooth mold releasing and reducing the weight of a mold, and also to provide a glove molding apparatus using the same. SOLUTION: The glove molding apparatus is equipped with: a cylindrical vacuum box 1; an upper mold 2 used for molding the surface of a glove and made axially movable while keeping hermetic sealing with respect to the vacuum box 1; the synthetic resin holding fixture 3, which is arranged in opposed relation to the vacuum box 1 to be loaded with a plastically deformable synthetic resin plate 17; the split mold 4, which is arranged opposite the upper mold 2 to press the peripheral edge part of the synthetic resin plate 17 and can be separated from the peripheral edge part of the synthetic resin plate 17 in parallel to the synthetic resin plate 17; and a vacuum device for evacuating the space between the upper mold 2 and the split mold 4. The upper mold 2 and the split mold 4 are separated to expand the synthetic resin plate 17 toward the upper mold 2 under suction, and the upper mold 2 and the split mold 4 are allowed to approach each other to mold the surface of the glove, and by suction with the vacuum device to mold the projected part of the peripheral surface of the glove between the upper mold 2 and the split mold 4. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004136445(A) 申请公布日期 2004.05.13
申请号 JP20020294429 申请日期 2002.10.08
申请人 MATSUSHITA ELECTRIC WORKS LTD;ASAHI MATSUSHITA ELECTRIC WORKS LTD 发明人 NAKATANI YOSHIHIRO;SUGIMOTO MASAKAZU;IDE KOJI;SAKACHI KAZUHIRO
分类号 B29C51/36;B29C51/10;B29L22/00;B29L31/34;(IPC1-7):B29C51/10 主分类号 B29C51/36
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