发明名称 PACKAGE FOR HOUSING HIGH FREQUENCY CIRCUIT COMPONENT
摘要 PROBLEM TO BE SOLVED: To solve the problem that, as a wavelength is short in a high frequency region of a quasi-millimeter wave band or more such as 25 GHz, a lid body generates a resonance by the same action as in a dielectric resonator, so that a transmission characteristic of a high frequency signal transmitting high frequency circuit components is deteriorated severely. SOLUTION: A package 3 for housing high frequency circuit components comprises an insulating base 1 which has a mounting part 1a of high frequency circuit parts 4 for use in a frequency region of 25 to 90 GHz on an upper surface thereof, and a lid body 2 which is joined to the upper surface of this insulating base 1 through a sealer 9 so as to enclose the mounting surface 1a, and which is composed of an insulator material, and the package 3 houses the high frequency circuit parts 4 hermetically inside an envelop which comprises the insulating base 1 and the lid body 2. When a thickness of the lid body 2 is T(mm) and a wavelength of the high frequency signal for use in the high frequency circuit parts 4 isλ(mm), T≤λ/4. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004146756(A) 申请公布日期 2004.05.20
申请号 JP20020346089 申请日期 2002.11.28
申请人 KYOCERA CORP 发明人 YATSUYAMA SHUNICHI;SHIRASAKI TAKAYUKI
分类号 H01L23/02;(IPC1-7):H01L23/02 主分类号 H01L23/02
代理机构 代理人
主权项
地址