MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which it is not necessary to increase the diameter or the depth of a hole for forming an insulating resin layer for constituting a build-up layer when via hole are formed in a core substrate or directly under and above a through hole. SOLUTION: The multilayer printed wiring board includes the core substrate 10 having a plurality of hole-embedding through holes 15 formed by filling a metal as a conducting means of a thickness direction, and an upper side build-up layer 50 and a lower side build-up layer 30 formed on both surface sides of the core substrate and having conducting non-penetrating via holes 55 and 35 directly above and below at least the one hole-embedding through hole. COPYRIGHT: (C)2004,JPO