| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a pattern so as to obtain a vertical profile of a resist wall during developing when a thick resist layer is formed by using a photosensitive film in a LIGA (Lithographie, Galvanoformung, Abformung)-like process. SOLUTION: In the method for forming a pattern to forming a thick film resist layer 21 by laminating a plurality of photosensitive films 20, each photosensitive film 20 is exposed at each time of lamination, and after all the photosensitive films 20 are laminated, they are developed. COPYRIGHT: (C)2004,JPO |
