| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-carrier tape for mounting electronic components wherein the bend and deformation of each film-carrier are reduced. SOLUTION: The film-carrier tape for mounting electronic components is so constituted as to form many wiring patterns made of a conductive metal on the surface of a long insulating film. The respective wiring patterns are coated with respective solder-resist layers independently of each other except for their connective terminal portions, and each solder-resist layer formed on the surface of each wiring pattern is divided into a plurality of auxiliary solder-resist layers. Consequently, in such a film-carrier tape for mounting electronic components in whose widthwise direction many film-carriers are arranged as CSP, COF, and BGA, the bend and deformation generated in each film-carrier can be reduced. COPYRIGHT: (C)2004,JPO
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