| 摘要 |
PROBLEM TO BE SOLVED: To provide a film sticking apparatus and a film sticking method wherein upon a fixing film being stuck to the rear surface of a semiconductor substrate (semiconductor wafer) there are eliminated any crack of the semiconductor substrate or containment of air bubbles between a sticking film and the semiconductor substrate, and crinkling of the film. SOLUTION: In a prior art method, a die attach film disposed on the semiconductor substrate is pressed with a roller and is stuck to a semiconductor substrate while the whole of the semiconductor substrate is being heated. Instead of the prior art method, the film is stuck to the semiconductor substrate while the roller is rotated and moved, and only a stuck part of the film is selectively heated. COPYRIGHT: (C)2004,JPO&NCIPI |
