发明名称 支持体及びその製造方法、配線基板の製造方法、電子部品装置の製造方法、配線構造体
摘要 A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer.
申请公布号 JP6054080(B2) 申请公布日期 2016.12.27
申请号 JP20120162005 申请日期 2012.07.20
申请人 新光電気工業株式会社 发明人 小林 和弘
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
代理机构 代理人
主权项
地址