| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that an external electrode which is formed on an end face or a side face may be brought into contact with an external electrode of a surrounding electronic component or a solder bridge may occur with a neighboring electronic component by forming a solder fillet when a surface-mounted inductor is mounted on a substrate of an electronic apparatus and soldered to a circuit pattern.SOLUTION: The surface-mounted inductor comprises: a coil that is formed by winding a lead wire; and a compact that is formed by using a sealant containing a resin and a magnetic material and incorporates a coil. The coil includes a wound portion and a lead-out end portion that is led out of the wound portion. A winding axis of the wound portion is embedded in the compact vertically with a mounting surface of the compact. In the lead-out end portion, a step is formed in such a manner that the step is led out of the wound portion to the mounting surface side of the compact and that a surface of a distal end portion is exposed and extends on the mounting surface of the compact, and an external terminal is formed on the mounting surface of the compact.SELECTED DRAWING: Figure 1 |
