| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED lamp capable of improving bondability of a bonding part in which different types of resin materials are integrally molded.SOLUTION: An LED lamp 1 includes: an LED substrate 16 mounting an LED 15; a base plate 13 on the surface of which the LED substrate 16 is placed; a body part 2 extending from a rear surface 13A of the base plate 13; a base 3 connected via an insulation cylinder part 10 having insulation properties provided at a terminal end of the body part 2. The body part 2 and the insulation cylinder part 10 are integrally molded from resin different from each other. The body part 2 at least includes a bent part 200 bent in a radial direction, at the terminal end 2A bonded with the insulation cylinder part 10. The bent part 200 is formed so as to be surrounded by the insulation cylinder part 10 from vertical direction and inward/outward direction.SELECTED DRAWING: Figure 3 |
