| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating film excellent in insulation/conduction reliability, and a multi-layer wiring board using the same. SOLUTION: The insulating film 3 has coating layers 2 made by adding inorganic insulating powder to a thermosetting resin, on the upper and lower surfaces of a liquid crystal polymer layer 1. The coating layer 2 is formed so that the inorganic insulating powder is partially protruded from the surface positioned on the side of the liquid crystal polymer layer 1 and has protrusions fitted in the liquid crystal polymer layer 1. COPYRIGHT: (C)2004,JPO&NCIPI |
