| 发明名称 |
POLISHING METHOD OF SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND POLISHING EQUIPMENT |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To restrain generation of a blemish and a scratch on a wafer surface. <P>SOLUTION: The method for manufacturing a semiconductor device includes a process for polishing a substrate by using CMP. In the polishing process, a tube type slurry feed pump 15 is used for supplying slurry. In the tube type slurry feed pump 15, vinyl chloride system tubing is used as the tubing 12 for supplying slurry. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
| 申请公布号 |
JP2004207422(A) |
申请公布日期 |
2004.07.22 |
| 申请号 |
JP20020373582 |
申请日期 |
2002.12.25 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
HAMANAKA MASASHI;SHIRAKASHI EIGO;ITOU FUMITAKA |
| 分类号 |
B24B37/00;B24B57/02;H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
B24B37/00 |
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