| 摘要 |
PROBLEM TO BE SOLVED: To provide a container for housing an electronic component which ensures air tightness of an electronic device even if the device is heated at the temperatures of 230-240°C when it is mounted on an external electronic circuit or the like, and uses leadless solder having superior corrosion resistance. SOLUTION: The container for housing the electronic component comprises: a substrate 5 having in its upper face a recess in which a mounting part for mounting the electronic component 6 on the bottom face is formed; a metallized layer 5a and a gold layer thereon both of which are formed around the entire periphery of the recess in the upper face of the substrate 5; and a lid 1 that is bonded to the gold layer by heating and melting a solder layer 3 essentially composed of tin which is adhered around the entire periphery of the under surface of the lid 1. The weight ratio of tin in the solder layer 3 to gold in the gold layer is 7:3 to 40:1. COPYRIGHT: (C)2004,JPO&NCIPI |
