| 摘要 |
The invention relates to a sealing structure ( 6 ) suitable for a polymer-based electronic device ( 1 ), charaterized in that the sealing structure ( 6 ) comprises a first layer ( 7 ) of a first dielectric material formed on said device ( 1 ) and a second layer ( 8 ) of a second dielectric material formed on the first layer ( 7 ). |
