| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having high heat-dissipating properties in the semiconductor device having a pattern for a heat dissipation between a wiring board, in which a wiring pattern and a terminal are formed, and a semiconductor element mounted on the wiring board. SOLUTION: The terminals connected to the wiring patterns 2, 2 and the like or thermal conductive members and the patterns 9 and 9 for the heat dissipation are connected by connecting patterns 11 and 11 or patterns for a thermal conduction. The thermal conductive members connected to the patterns 9 and 9 for the heat dissipation are formed on the backside of the wiring board 1 within a range that the patterns 9 and 9 for the heat dissipation are formed. The areas of the patterns 9 and 9 are made to correspond to the mounting area of the semiconductor element 4. COPYRIGHT: (C)2004,JPO&NCIPI |
