A semiconductor device (31) having bumps (36) is to be mounted on a board (33) having pads (34) so that each of the bumps (36) is joined to a corresponding one of the pads (34). Adhesive (39) to be hardened by heat is provided between the semiconductor device (31) and the board (33). The mounting method includes the steps of pressing the bumps (36) of the semiconductor device (31) on the pads (34) of the board (33), and heating a portion in which each of the bumps (36) and a corresponding one of the pads (34) are in contact with each other. A pressure of the bumps (36) to the pads (34) reaches a predetermined value before a temperature of the adhesive (39) to which heat is supplied in the above step reaches a temperature at which the adhesive (39) is hardened.
