| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor package which is capable of using a general-purpose automatic mounting machine, reducing the deterioration of high-frequency signals in transmission characteristics at a wire-bonded part having a high impedance, and superior in high-frequency characteristics. SOLUTION: First, a two-stage structured through-hole composed of two through-holes 12a and 12b different from each other in diameter is provided to a metal base 11, the through-hole 12b on the element mounting surface side is set smaller in diameter than the through-hole 12a on the opposite side, a center conductor 13 is supported by a solid dielectric material 14 filling the through-hole 12a, and gas such as air or the like is made to serve as a dielectric material in the through-hole 12b. Second, a metal wall to serve as an installation conductor is provided near a bonding wire connecting the optical semiconductor element to the center conductor or near the center conductor protruding from the solid dielectric material 14, or a ditched part is provided to the metal base 11. COPYRIGHT: (C)2004,JPO&NCIPI
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