发明名称 |
Transfer system and transfer method |
摘要 |
A transfer system 1 comprising: a conveying/positioning device 3 configured to convey and position a flat sheet-shaped mold MA in a predetermined direction, on which a fine transfer pattern M1 is formed; a transfer device 5 configured to transfer the fine transfer pattern M1 to a molding target W, the transfer device 5 being provided on an upstream side in the conveying direction of the sheet-shaped mold MA; and a peeling device 7 configured to peel off the sheet-shaped mold MA and the molding target from those mutually clinging to each other, after the transfer by the transfer device 5 is performed and the conveyance by the conveying/positioning device 3 is performed, the peeling device 7 being provided on a downstream side in the conveying direction of the sheet-shaped mold MA. |
申请公布号 |
US9452563(B2) |
申请公布日期 |
2016.09.27 |
申请号 |
US201113581266 |
申请日期 |
2011.02.24 |
申请人 |
TOSHIBA KIKAI KABUSHIKI KAISHA |
发明人 |
Itani Shinya;Nishihara Hiromi;Baba Takato;Tashiro Takaharu;Ookawa Takafumi;Kitahara Hidetoshi |
分类号 |
B29C31/00;B29C59/02;B29C37/00;B29C59/04;B29C35/08 |
主分类号 |
B29C31/00 |
代理机构 |
DLA Piper LLP US |
代理人 |
DLA Piper LLP US |
主权项 |
1. A transfer system comprising:
a conveying/positioning device configured to convey and position a flat sheet-shaped mold in a predetermined direction, on which a fine transfer pattern is formed; a transfer device configured to transfer the fine transfer pattern to a molding target, the transfer device being provided at a position in the conveying direction of the conveying/positioning device, the transfer device comprising a press body and a molding target placing body configured to place the molding target thereon, the transfer device being configured to sandwich the molding target and the flat sheet-shaped mold between the press body and the molding target placing body to perform the transfer, the press body comprising:
a base material comprising a highly rigid material;shock-absorbing material provided in a layer covering the base material and configured to sandwich the molding target and the flat sheet-shaped mold between the press body and the molding target placing body; anda mold contact material provided in a layer covering the shock-absorbing material; and a peeling device configured to peel off the sheet-shaped mold and the molding target from those mutually clinging to each other, after the transfer by the transfer device is performed and the conveyance by the conveying/positioning device is performed, the peeling device being provided on a downstream side from the transfer device in the conveying direction of the conveying/positioning device, wherein the conveying/positioning device stops conveyance of the flat sheet-shaped mold when the transfer device performs the transfer or the peeling device performs the peeling. |
地址 |
Tokyo JP |