PROCESS FOR PRODUCING HEAT SINK, HEAT SINK,SUBSTRATE FOR POWER MODULE EMPLOYING THE HEAT SINK, AND POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a process for producing a heat sink in which warp can be reduced regardless of a difference in thermal expansion coefficient between an insulating substrate and the heat sink and lowering of thermal conductivity can be suppressed, and to provide the heat sink, a substrate for a power module employing that heat sink, and the power module. SOLUTION: In the process for producing a heat sink 16 for dissipated heat of a heat radiating body, a low thermal expansion material 18 having a thermal expansion coefficient lower than that of a plate-like body 17a and provided with openings communicating with the thickness direction from one side to the other side and communicating with each other in the direction intersecting the thickness direction is interposed between the plate-like bodies 17a made of pure Cu or an Cu alloy. Under a state where the low thermal expansion material 18 is sandwiched by respective plate-like bodies 17a, melt of pure Cu or an Cu alloy is poured between the plate-like bodies 17a thus casting the low thermal expansion material 18. COPYRIGHT: (C)2004,JPO&NCIPI