| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board member using a flexible film equipped with a circuit pattern excellent in dimensional accuracy and capable of being separated from a reinforcing plate with a low stress without producing creases or a distortion, and to provide a method of manufacturing a circuit board. SOLUTION: The reinforcing plate, a separable organic material layer, the flexible film where the circuit pattern has been formed, and a separation auxiliary layer, are stacked up in this sequence into the circuit board member. In the method of separating the flexible film with the circuit pattern stuck on the reinforcing plate through the intermediary of the separable organic layer, the separation auxiliary layer is formed on the circuit pattern first, and then the flexible film is separated from the reinforcing plate. COPYRIGHT: (C)2004,JPO&NCIPI |
