| 摘要 |
A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps having a surface roughness on the tip face thereof of 0.2 to 20 mum are formed by forming an etching mask for bump formation on bump formation surface of a metal foil which has a thickness (t1+t2) which is the sum of a thickness t1 of a wiring circuit and a height t2 of bumps to be formed on wiring circuit and which has a surface roughness of the bump formation surface thereof of 0.2 to 20 mum, and half etching the metal foil from the side of the etching mask for bump formation to a depth corresponding to the desired bump height t2. |
