| 发明名称 |
Method of fabrication of semiconductor integrated circuit device |
| 摘要 |
In order to shorten the time needed for fabricating semiconductor integrated circuit devices, a wafer is exposed while a chip area with defects of a mask is covered with a masking blade for light shielding. |
| 申请公布号 |
US6800421(B2) |
申请公布日期 |
2004.10.05 |
| 申请号 |
US20010996762 |
申请日期 |
2001.11.30 |
| 申请人 |
RENESAS TECHNOLOGY CORP. |
发明人 |
HASEGAWA NORIO;TANAKA TOSHIHIKO |
| 分类号 |
G03F1/08;G03F1/54;G03F1/56;G03F1/58;G03F1/72;G03F1/84;G03F7/00;G03F7/20;H01L21/027;(IPC1-7):G03C5/00 |
主分类号 |
G03F1/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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