| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating device that is excellent in maintainability and does not leave marks of thermal transfer on a substrate. SOLUTION: Supporting balls 50 connected to each other through wire rods 54 are placed on the surface of a hot plate 45. The supporting balls 50 are formed of, for example, a PEEK (polyether ether ketone). The wire rods 54 are formed of, for example, SUS (stainless steel) etc., and have hooks 54a used for attaching the wire rods 54 to the hot plate 45 at both ends. Before connecting the supporting balls 50 to each other through the wire rods 54, holes having a size with which a wire rod 54 can pass through the hole are previously formed in the balls 50. In addition, springs are attached to one ends of the wire rods 54. The wire rods 54 are passed through the holes of the supporting balls 50 and the balls 50 are fixed to the wire rods 54. COPYRIGHT: (C)2005,JPO&NCIPI |
