发明名称 |
TRANSPARENT ELECTRODE-EQUIPPED SUBSTRATE AND METHOD FOR PRODUCING TRANSPARENT ELECTRODE-EQUIPPED SUBSTRATE |
摘要 |
A transparent electrode-equipped substrate (21) is provided with a metal oxide transparent electrode layer (13) on a transparent substrate (12). The average maximum curvature Ssc of the surface of the transparent electrode layer is preferably 5.4 × 10-4 nm-1 or less. For example, if the transparent electrode layer is subjected to a surface treatment by low discharge-power sputtering after film formation, the Ssc of the transparent electrode layer can be reduced. This transparent electrode-equipped substrate excels in close adhesion between the transparent electrode layer (13) and a metal lead wire (14) disposed on the transparent electrode layer. The transparent electrode layer (13) is obtained by, for example, performing a transparent electrode film-production step through the application of a first discharge power and then performing a surface treatment step through the application of a second discharge power. |
申请公布号 |
WO2016152808(A1) |
申请公布日期 |
2016.09.29 |
申请号 |
WO2016JP58808 |
申请日期 |
2016.03.18 |
申请人 |
KANEKA CORPORATION |
发明人 |
HAYAKAWA, Hironori;OMOTO, Shinya;KUCHIYAMA, Takashi |
分类号 |
C23C14/58;B32B7/02;C23C14/08;C23C14/34;G06F3/041;H01B5/14;H01B13/00 |
主分类号 |
C23C14/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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