发明名称 METHOD FOR FABRICATING SOLID STATE IMAGE PICK-UP DEVICE TO OBTAIN PLURAL BASE UNITS WITH IMPROVED PLANARIZATION
摘要 PURPOSE: A method for fabricating a solid state image pick-up device is provided to obtain a plurality of base units with improved planarization by preventing the base unit from being twisted or warped. CONSTITUTION: A pair of dies(12,13) form a cavity for molding a plurality of base units. A plurality of pins(14) for forming a plurality of position determining holes in the thickness direction of the base units are installed in the dies by using a tape material(11) to which a metal thin plate lead(10) for forming a plurality of groups of interconnections corresponding to the plurality of base units. The tape material is loaded into a gap between the pair of dies to dispose the metal thin plate lead in a region of the cavity corresponding to the plurality of base unit. Encapsulation resin is filled and cured in the cavity. A resin molding material(15) in which the metal thin plate lead is buried is taken out from the dies. The tape material is eliminated from the resin molding material. The resin molding material is separated into a plurality of pieces corresponding to the base units in which the interconnection is buried so that an image pick-up device is mounted on the surface of the base unit in which the interconnection is buried.
申请公布号 KR20040093361(A) 申请公布日期 2004.11.05
申请号 KR20030067841 申请日期 2003.09.30
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 MINAMIO MASANORI;HORIKI HIROSHI;NOSHIO TETSUSHI
分类号 H01L27/14;H01L23/00;H01L23/08;H01L27/146;H01L31/02;H01L31/0203;H04N5/335 主分类号 H01L27/14
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