发明名称 |
LIGHT DELIVERY METHOD, LIGHT DELIVERY SYSTEM AND WAFER EDGE EXPOSURE APPARATUS WITH THE SAME |
摘要 |
PURPOSE: A light delivery method, a light delivery system and a WEE(Wafer Edge Exposure) apparatus with the same are provided to reduce WEE time and to improve throughput per a unit time by delivering each split ray of laser beam having the same intensity to WEE units at a time using splitters. CONSTITUTION: A ray of laser beam is generated from a laser(202). The laser beam is split into rays of laser beam by using a plurality of splitters(210). At this time, the split rays of laser beam have the same intensity. The split rays of laser beam are guided to edges of wafers, respectively. The laser beam is one selected from a group consisting of XeF, XeCl, KrF, ArF, or F2 excimer laser beam.
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申请公布号 |
KR20040093198(A) |
申请公布日期 |
2004.11.05 |
申请号 |
KR20030025307 |
申请日期 |
2003.04.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, JUNG HYEON;LEE, SEONG U;SIM, U SEOK;YEO, GI SEONG |
分类号 |
G01B9/02;G03F7/20;H01L21/027;(IPC1-7):H01L21/027 |
主分类号 |
G01B9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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