发明名称 |
PROCESS FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a process for manufacturing an electronic component such that surface conductors are not short-circuited even if they are formed at a narrow pitch. SOLUTION: When surface conductors are formed after providing a recess between them, paste bleeding over a scheduled print size or a very small quantity of paste scattered in printing is formed in the recess. Subsequently, the recess is filled with an insulating material including the bleeding part and the scattered part. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2004335676(A) |
申请公布日期 |
2004.11.25 |
申请号 |
JP20030128665 |
申请日期 |
2003.05.07 |
申请人 |
MURATA MFG CO LTD |
发明人 |
NISHIZAWA YOSHIHIKO;KATO ISAO;KAWADA MASAKI |
分类号 |
H05K3/12;H05K3/20;H05K3/22;(IPC1-7):H05K3/12 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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