发明名称 PROCESS FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a process for manufacturing an electronic component such that surface conductors are not short-circuited even if they are formed at a narrow pitch. SOLUTION: When surface conductors are formed after providing a recess between them, paste bleeding over a scheduled print size or a very small quantity of paste scattered in printing is formed in the recess. Subsequently, the recess is filled with an insulating material including the bleeding part and the scattered part. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004335676(A) 申请公布日期 2004.11.25
申请号 JP20030128665 申请日期 2003.05.07
申请人 MURATA MFG CO LTD 发明人 NISHIZAWA YOSHIHIKO;KATO ISAO;KAWADA MASAKI
分类号 H05K3/12;H05K3/20;H05K3/22;(IPC1-7):H05K3/12 主分类号 H05K3/12
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