| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make realizable a small and high-density mold chip having an end electrode which exhibits highly reliable electrical connection and solder joint, even in a condition where a member for preventing entry of sealing resin into a through hole is stuck onto an upper surface side of the through hole. <P>SOLUTION: A circuit board provided with the non-through conduction hole for an end electrode on a dividing and cutting line for dicing comprises an upper circuit board having a part-connecting land for mounting an electronic part or an electronic part element thereon, a second blind via (B2) of a lower circuit board which is disposed on the dividing and cutting line, and a first blind via (B1) for electrically connecting the part-connecting land of the upper circuit board and the second blind via (B2) of the lower circuit board. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
