发明名称 METHOD FOR FILLING HOLE OF THERMOPLASTIC RESIN MOLDING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for filling the hole of a thermoplastic resin molding which can save labor, reduce costs, and fill the hole to put up with a high pressure of at least 1 MPa. <P>SOLUTION: The method includes an expansion process in which a funnel-shaped expansion part 14 expanding toward the outside is formed in relation to the hole 24a formed in the thermoplastic resin molding (molding 11) and a sealing process in which a thermoplastic resin plug 27 in a shape corresponding to the expansion part 14, while being rotated, is rotation friction-welded to the expansion part 14. In the method, before the expansion process, a packing process in which a thermoplastic resin cylindrical body 12 having a diameter corresponding to that of the hole 24a, while being rotated, is inserted into the hole 24a formed in the molding 11 is preferably provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004338279(A) 申请公布日期 2004.12.02
申请号 JP20030139005 申请日期 2003.05.16
申请人 HEISEI POLYMER CO LTD 发明人 KOGA TOSHIYOSHI;YAMASHITA KAZUYUKI;NODA SUSUMU;TAKEUCHI AKIHIRO
分类号 B29C65/06;B29K101/12;(IPC1-7):B29C65/06 主分类号 B29C65/06
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