| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which dust intruding into the recess of a package can be removed and high sensitivity characteristics of the semiconductor device can be sustained. SOLUTION: The semiconductor device comprises a package 1 having a recess 2 in the upper surface, an internal terminal 6 arranged at the circumferential fringe part on the bottom face of the recess, an external terminal 7 arranged on the outer circumferential surface of the sidewall 4 of the package surrounding the recess and connected with the internal terminal while penetrating the sidewall, a semiconductor element 8 bonded to the bottom face of the recess and having an imaging function, a conductor 11 for connecting an electrode terminal 10 arranged at the circumferential fringe part on the major face of the semiconductor element with the internal terminal, a cover 13 being applied removably to the upper surface of the sidewall while shielding the recess of the package, and a dust-proof film 19 or a glass plate fixed to the upper or lower surface of the cover. COPYRIGHT: (C)2005,JPO&NCIPI |
