| 摘要 |
PURPOSE: A semiconductor wafer sawing machine is provided to produce uniform-sized semiconductor chips, to reduce processing time and to remove particles by using a blade with at least two end portions and a suction. CONSTITUTION: A semiconductor wafer sawing machine includes a blade(100). The blade includes at least two or more end portions(100a,100b). The end portions are spaced apart from each other and formed as one piece. A suction is installed at a side of the blade to remove particles.
|
