| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated ceramic electronic component including a step wherein a laminated body can easily and delicately be baked without deteriorating the characteristics of a ceramic green sheet, by adjusting an exfoliating force of the ceramic green sheet from a carrier film. SOLUTION: The manufacturing method of the laminated ceramic electronic component, in which the ceramic green sheet 2 is formed on the carrier film 1, the ceramic green sheet 2 supported by the carrier film 1 is exfoliated from the carrier film 1, the ceramic green sheets 2 are layered, the obtained laminated body is baked, and external electrodes are formed by a sintered body obtained by the baking, is characterised in that the exfoliating force for exfoliating the ceramic green sheet 2 from the carrier film 1 is adjusted within a range of 18 to 550 mN/54 mm by adjusting ratios of a plurality of solvents in a ceramic slurry for forming the ceramic green sheet 2. COPYRIGHT: (C)2005,JPO&NCIPI |
