| 发明名称 | Coil substrate, method of manufacturing the same, and inductor | ||
| 摘要 | A coil substrate includes a plurality of structural bodies, each of which comprises a first insulating layer, a wiring formed on the first insulating layer and configured to serve as a part of a spiral coil, and a second insulating layer formed on the first insulating layer and configured to cover the wiring. The plurality of structural bodies are stacked via an adhesion layer. The spiral coil is formed by series-connecting the wirings of adjacent ones of the plurality of structural bodies. | ||
| 申请公布号 | US9472332(B2) | 申请公布日期 | 2016.10.18 |
| 申请号 | US201414341868 | 申请日期 | 2014.07.28 |
| 申请人 | SHINKO ELECTRIC INDUSTRIES CO., LTD. | 发明人 | Nakamura Atsushi;Sato Kiyokazu |
| 分类号 | H01F5/00;H01F17/00 | 主分类号 | H01F5/00 |
| 代理机构 | Drinker Biddle & Reath LLP | 代理人 | Drinker Biddle & Reath LLP |
| 主权项 | 1. A coil substrate comprising: a plurality of structural bodies, each of which comprises a first insulating layer, a wiring formed on the first insulating layer and configured to serve as a part of a spiral coil, and a second insulating layer formed on the first insulating layer and configured to cover the wiring, wherein the plurality of structural bodies are stacked such that a side of one structural body having the first insulating layer faces a side of an adjacent structural body having the second insulating layer, and wherein the spiral coil is formed by series-connecting the wirings of adjacent ones of the plurality of structural bodies. | ||
| 地址 | Nagano-shi, Nagano JP | ||