发明名称 CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable resin composition wherein an obtained cured article is excellent in heat resistance, flexibility, adhesiveness, etc. SOLUTION: The curable resin composition essentially comprises a cyanate resin and a specific polyamide resin. Preferably, the polyamide resin has a wt. average mol.wt. of 10,000-50,000. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005097428(A) 申请公布日期 2005.04.14
申请号 JP20030333132 申请日期 2003.09.25
申请人 MITSUBISHI GAS CHEM CO INC 发明人 IKEGUCHI NOBUYUKI;MISHIMA HIROYUKI;MORI KENICHI;MINE TAKAKIYO
分类号 C08L79/00;C08L77/06;H05K1/03;H05K3/46;(IPC1-7):C08L79/00 主分类号 C08L79/00
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