| 摘要 |
The invention describes a method for producing chip cards with contactless and/or contact-type operation having a multilayer card body, an integrated circuit and at least one coil ( 2, 21 ) for data exchange and for power supply. The coil ( 2, 21 ) is applied to one or more layers ( 11 ) of the card body by printing technology, whereby after production of the printed coil a metal foil ( 4, 41 ) is placed over the coil terminals ( 32, 33 ) and laminated into the card body, thereby producing the connection between the contact areas ( 32, 33 ) of the printed coil and the metal foil ( 4, 41 ). |
