发明名称 METHOD FOR MANUFACTURING LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND PORTABLE APPARATUS AND ELECTRONIC DEVICE THEREWITH
摘要 PROBLEM TO BE SOLVED: To prevent sneaking of a packaging resin to the lower face of a lead part when a lead frame is manufactured by pressing. SOLUTION: A metal plate 100 is punched out from its lower-surface side by a punch 81 to form a lead 2. Next, the lead 2 is crushed from its tip lower side by a punch 82 to form a tip removal stopping portion. After the tip end is cut at a specified length, the lead 2 is entirely crushed by a punch 83. Thus, sagging of the lower face in the lead 2 is eliminated. Then, a punch 85 is used to shape the lower surface of the lead 2 as well as to form removal stopping steps on both sides. Furthermore, a punch 84 is used to form a V-notch on the upper surface of the lead 2. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005116705(A) 申请公布日期 2005.04.28
申请号 JP20030347415 申请日期 2003.10.06
申请人 ROHM CO LTD 发明人 KISHIMOTO ICHIRO
分类号 H01L23/50;H01L21/44;H01L21/48;H01L21/50;H01L23/31;(IPC1-7):H01L23/50 主分类号 H01L23/50
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