| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a plating apparatus where a plating film having a flat surface and satisfactory film quality can be easily formed regardless of variation in the shape of a wiring pattern and the management of the plating liquid can be easily performed by mutually separating an aged plating liquid and a fresh plating liquid, and to provide a plating method. <P>SOLUTION: The plating apparatus is provided with: a substrate stage 504 for holding a substrate; a cathode portion 506 including a sealing member 514 for contacting a peripheral portion of a surface, to be plated, of the substrate W held by said substrate stage 504 to seal said peripheral portion water-tightly, and a cathode electrode 512 for contacting the substrate W to supply current to the substrate; an anode 526 disposed so as to face the surface, to be plated, of the substrate W; an ion exchange membrane 532 disposed between said anode 526 and the surface, to be plated, of the substrate W, and having water retentivity; a pressing mechanism 540 for pressing the ion exchange membrane 532 against the surface, to be plated, of the substrate W held by the substrate stage 504 with optional force; and a driving mechanism for relatively driving the ions exchange membrane 532 and the substrate W. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
