| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To mitigate the vertical stress of a filler applied on an IC chip, and suppress the change of characteristics of an element formed on the surface of the IC chip as much as possible, in the semiconductor device constituted of the IC chip, sealed so as to wrap the same by mold resin containing the filler. <P>SOLUTION: In the semiconductor device constituted of the IC chip 10 sealed by the mold resin 40 containing the filler 41 so as to wrap the same, a surface 11 contacted with the mold resin 40 in the IC chip 10 is covered by a column type projections 15 projected from the surface 11 and arrayed with a space smaller than the minimum diameter of the filler 41 contained in the mold resin 40. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
