发明名称 TOUCH PANEL ASSEMBLY AND ELECTRONIC PART PACKAGING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a touch panel assembly that reduces the space of the entire assembly including a touch panel and an electronic circuit, and provide a packaging method that simply and reliably packages electronic parts into the touch panel assembly. <P>SOLUTION: The touch panel assembly 10 has the touch panel 12 having a film 16 and a glass plate 18 surface-coated with a conductive coating and opposed to each other, and a circuit board 14 conductively connected to the touch panel 12. The glass plate 18 is mounted directly on the circuit board 14. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005174254(A) 申请公布日期 2005.06.30
申请号 JP20030417075 申请日期 2003.12.15
申请人 FUJITSU COMPONENT LTD 发明人 KONDO KOICHI;NAKAZAWA MITSUAKI
分类号 G06F3/041;G06F3/033;H01H11/00;H01H13/70;H01H13/712;(IPC1-7):G06F3/033 主分类号 G06F3/041
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