CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING SAME

摘要

PROBLEM TO BE SOLVED: To provide a ceramic substrate which has no cracking nor breaking when only one face of the ceramic substrate is resin-sealed by molding method and which has no displacement of electrodes.

SOLUTION: The ceramic substrate has an internal electrode for packaging a plurality of semiconductor elements on one principal plane and an external electrode to be connected to the internal electrode on the backside of the principal plane. When resin-sealing the plurality of semiconductor elements packaged on one principal plane, a metal film which has nearly the same height as the external electrode and is divided at predetermined intervals is formed at least on the rear face of the ceramic substrate held between metal molds for sealing.

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