| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the disconnection of a conductive wiring which is arranged so as to intersect an outer edge of a semiconductor device and to traverse an end part, when temperature changes are added repeatedly, in a BGA type semiconductor device. <P>SOLUTION: A deformation amount when temperature changes are added to an insulating film is reduced, or restrained, by forming a broad portion 13 on a surface wiring 12 traversing an outer edge portion 1a of the semiconductor device 1 on a surface wiring 2 of an interposer 4, such as a printed-circuit board. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
