| 摘要 |
<p>A wafer transcription method by which pick up is made possible by using a general purpose pick up apparatus. A wafer (1), of which a circuit side is fixed on a first frame (3) through a first adhesive sheet (2), is transcribed into a status where a side opposite to the circuit side is fixed on a second frame (6) through a second adhesive sheet (7) by the wafer transcription method. The wafer (1) fixed on the first frame (3) is permitted to abut on a transcription table (5) having a diameter larger than that of the wafer (1) but smaller than the inner diameter of the first frame (3), with the first adhesive sheet (2) at the bottom, then, the first frame (3) is pulled down, and under such conditions, the second frame (6) whereupon the second adhesive sheet (7) is stuck is arranged above the wafer (1). After sticking the second adhesive sheet (7) on the wafer (1), the first adhesive sheet (2) is peeled from the wafer (1), and the wafer (1) is transcribed on the second frame (6).</p> |
