| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet which can sufficiently reduce the development of the peeling prior to the use between a removable base material and a laminated body and which, in the step of stripping the laminated body from the removable base material and attaching it to a semiconductor wafer, can sufficiently reduce the development of defective stripping. SOLUTION: The adhesive sheet has a structure of which the removable base material 12, the adhesive layer 14, the tacky layer 22, and the substrate film 24 are successively laminated. The adhesive layer 14 is partially formed on the removable base material 12, the tacky layer 22 covers the adhesive layer 14 and is formed so that its peripheral part comes into contact with the removable base material 12, the removable base material 12 is 3-100μm thick and has a tensile modulus at 25°C of≥1,000 MPa, the substrate film 24 is 20-300μm thick and has a tensile modulus at 25°C of 10-300 MPa, and the 90°peel strength at 25°C between the removable base material 12 and the tacky layer 22 is 0.1-20 N/m. COPYRIGHT: (C)2005,JPO&NCIPI |
