Laser cutting method for removing electronic components from lead board, uses inert gas atmosphere containing laser activated reagent

摘要

#CMT# #/CMT# The inert gas contains a reagent activated by laser radiation. #CMT# : #/CMT# A method for separating electronic components (12) under a substantially inert gas atmosphere comprises the use of a laser beam (3). The gas contains a reagent which is activated by the laser radiation. An independent claim is also included for the separator device, comprising a laser source (2), at least one holder (9) for an arrangement of unsorted electronic components, a means (5) for supplying the inert gas and a means (6) for supplying the reagent. The laser source and holder can be moved relative to each other. #CMT#USE : #/CMT# For separating electronic components from lead frames or boards during the production of semiconductor products. #CMT#ADVANTAGE : #/CMT# The radicals generated by the reagent prevent the deposition of foreign material on the components during laser cutting. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a cross-section of the separator device. 2 : Laser source 3 : Laser beam 5 : Inert gas supply 6 : Reagent supply 9 : Holders 12 : Electronic components #CMT#INORGANIC CHEMISTRY : #/CMT# The reagent comprises hydrogen, which is converted into radicals by the laser radiation. The hydrogen is formed by electrolysis of water.