| 摘要 |
<p>Formation of a Cu film on a fine pattern provided with a Cu diffusion preventing film, in which the surface of the Cu diffusion preventing film over a substrate to be treated is cleaned according to the cleaning method using a supercritical medium and in which further, Cu film formation using a supercritical medium is carried out to thereby achieve formation of void-free Cu film with high adhesion to the fine pattern. In particular, the above is accomplished through a substrate processing method characterized by comprising the first step of feeding a first treatment medium containing a supercritical medium onto a substrate to be treated so as to clean a metallic film lying at the surface of the substrate to be treated and the second step of feeding a second treatment medium containing the supercritical medium onto the substrate to thereby form a Cu film.</p> |
