| 摘要 |
<p>The invention relates to the gluing of plastic pieces, in particular, Flexible Printed Circuit Boards (FPCB's). According to the invention, a thermally-activated adhesive is used for the gluing, comprising (i) at least one thermoplastic polymer or a modified rubber and (ii) at least one resin, preferably comprising at least one phenol resin and at least one epoxy resin.</p> |
