| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a system in package and its verification method which is capable of function verification of chips mounted without providing any special test circuit and effectively utilizing the chip in the package. <P>SOLUTION: In a mounting substrate (PWB) 11 of the system in a package SiP1, regular operation circuits 12, 13 where regular circuits are constituted, and a programable logic circuit 14 connected with a bonding wire 18 are implemented. The programable logic circuit 14 is a function verification circuit executing function verification of the semiconductor chips 12, 13 in a test mode for implementation test after implementation. After the implementation test, the logic circuit is rewritten to a desired function circuit to be a regular operation circuit. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
