| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact semiconductor package which can be laminated easily, and to provide its manufacturing method. SOLUTION: The semiconductor package 10 is constituted such that a connecting terminal 12 and a bump 15 provided on a semiconductor chip 11 may be wired by a wiring layer 13. It comprises a semiconductor chip, a conductive post 14 exposing its upper face and lower face embedded around the circumference of the chip, and the wiring layer 13 for connecting the conductive post 14 and the connecting terminal 12 on the semiconductor chip 11. In this way, the semiconductor package 10 has such a structure that the upper face and the lower face can be energized, and the semiconductor package 10 can be laminated easily. COPYRIGHT: (C)2006,JPO&NCIPI |
