IMAGE SENSOR HAVING SENSITIVE ZONE PROTECTION PACKAGE STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an image sensor having sensitive zone protection package structure in which a bank capable of separating dust and shielding scattered light is formed on the outer periphery of a sensitive zone of a chip included in the image sensor in which a flip chip is packaged. SOLUTION: The image sensor is provided with a light transmitting substrate 1 having an upper surface 11 and a lower surface 12 on which a conductive link circuit 121 is formed and a semiconductor image sensitive chip 2 of which the upper surface is electrically connected to the conductive link circuit 121 formed on the lower surface 12 of the light transmitting substrate 1 and in which the outer periphery of a die is filled with resin 23. A bank 122 is formed on the outer periphery of the image sensitive zone 20 of the semiconductor image sensitive chip 2 and an electrical node of the chip 2 is located on the outside of the bank 122. COPYRIGHT: (C)2006,JPO&NCIPI