发明名称 MANUFACTURING METHOD OF RIGID FLEXIBLE METAL-CLAD LAMINATE AND MANUFACTURING METHOD OF RIGID FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide the manufacturing methods of a rigid flexible metal-clad laminate and a rigid flexible printed wiring board each omitting a preliminary embedding with a highly fluid resin in convenient ways. SOLUTION: In the manufacturing method of a four-layered rigid flexible metal-clad laminate, the flexible printed wiring board is a core material, the rigid substrates are laminated so as to allow a part of the flexible printed wiring board to be exposed, and flexible metal-clad laminate where the rigid substrate and a metal foil are disposed on the surface of the flexible printed wiring board that is the core material. The method includes: a press process for fluidizing a semicured resin comprising the rigid base material so as to inflow into and embed the inter-circuit gap of the flexible printed wiring board or the like to terminate a heating press processing in the semicured condition as it stands; a desmear process for removing the component resin of the rigid substrate that has inflown into the exposed region of the flexible printed wiring board; and a heating hardening process for hardening the semicured resin or the like is adopted. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005333094(A) 申请公布日期 2005.12.02
申请号 JP20040152617 申请日期 2004.05.21
申请人 MITSUI MINING & SMELTING CO LTD 发明人 NAKAMURA KENSUKE
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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