发明名称 |
ADHESIVE FILM FOR PROTECTING SEMICONDUCTOR WAFER SURFACE, AND SEMICONDUCTOR WAFER PROTECTING METHOD USING ADHESIVE FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer surface protecting adhesive film which protects a semiconductor wafer from breakage even if the wafer is thinned to have a thickness of 150μm or less and can be peeled off the wafer in the same time as it takes in a conventional method, and to provide a semiconductor wafer protecting method using the adhesive film. SOLUTION: The semiconductor wafer surface protecting adhesive film is composed of a base film, and an adhesive layer formed on one surface thereof. The base film includes at least one resin layer (A) 10-200μm thick, which shows a shrinkage factor both in a mechanical direction (MD direction) and in a direction perpendicular to the mechanical direction (TD direction) of less than 5% when manufactured at 50°C and shows a shrinkage factor at least either in the MD direction or in the TD direction of 5-99% when heated in hot water or an atmosphere of 70-100°C for one second or longer. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005347382(A) |
申请公布日期 |
2005.12.15 |
申请号 |
JP20040163052 |
申请日期 |
2004.06.01 |
申请人 |
MITSUI CHEMICALS INC |
发明人 |
KOSHIMIZU TAKANOBU;URAKAWA TOSHIYA;SAIMOTO YOSHIHISA;HAYAKAWA SHINICHI |
分类号 |
H01L21/683;H01L21/304;H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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地址 |
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